Effect of heterostructure configuration and shape design on cooling performance

The article examines the influence of the semiconductor heterostructures’ configuration and shape design on the cooling performance of optoelectronic devices. The authors investigate how the heat sink geometry and the active elements’ arrangement define the heat flow paths, local overheating, and the temperature fluctuation magnitude. In terms of temperature field uniformity and heat dissipation capability, the paper compares various structural alternatives. It is confirmed that the optimal shape design and layout of the heterostructure components significantly improve the heat dissipation and the stability of the specified devices despite using the same materials.

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