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Proceedings in Cybernetics

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Turetsky A.V., Pirogov A.A., Sviridova I.V., Khoroshailova M.V., Syomka E.V. Analysis of the infl uence of solder mask roughness and stencil shape on the formation of voids in solder joints. Proceedings in Cybernetics. 2024;23(3):70-81. (In Russ.) https://doi.org/10.35266/1999-7604-2024-3-8

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ISSN 1999-7604 (Online)

628412, Khanty-Mansi Autonomous Okrug – Yugra, Surgut, Lenina pr., 1

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