For citations:
Turetsky A.V., Pirogov A.A., Sviridova I.V., Khoroshailova M.V., Syomka E.V. Analysis of the infl uence of solder mask roughness and stencil shape on the formation of voids in solder joints. Proceedings in Cybernetics. 2024;23(3):70-81. (In Russ.) https://doi.org/10.35266/1999-7604-2024-3-8
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