Analysis of the infl uence of solder mask roughness and stencil shape on the formation of voids in solder joints
https://doi.org/10.35266/1999-7604-2024-3-8
Abstract
The analysis of the causes of occurrence and ways of minimizing voids that are formed inside soldered joints is carried out. Voids that form during soldering signifi cantly reduce both the mechanical and electrical strength of the joint. In addition, thermal conductivity signifi cantly decreases, especially in component housings, where the soldered joint also acts as a heatsink.
We propose two alternative approaches leading to a decrease in the formation of voids in soldered joints. The fi rst approach involves changing the roughness of the solder mask, which affects the distribution of fl ux
around the contact pad. Research shows that a higher roughness of the solder mask positively affects the better spreading of the fl ux released during solder refl ow. Here, the fl ux spot is larger and less of it gets into the
solde red joint, which leads to a minimization of the volume and number of voids. The second approach includes applying not one large amount of solder paste, but several small ones, separated by small gaps. Moreover, to maintain the volume of the solder dose, it is proposed to use thicker stencils
to apply solder paste. The presence of gaps between the spots of solder paste contributes to better displacement of gases released during refl ow.
Keywords
reliability of radio-electronic equipment,
installation of electronic components,
voids in solder joints,
fl ux
Supporting agencies: the work is carried out alongside the Educational Design Center for Electronics “Silovaya elektronika” at the Voronezh State Technical University
About the Authors
A. V. Turetsky
Voronezh State Technical University, Voronezh
Russian Federation
Russian Federation
Candidate of Sciences (Engineering), Docent
A. A. Pirogov
Voronezh State Technical University, Voronezh
Russian Federation
Russian Federation
Candidate of Sciences (Engineering), Docent
I. V. Sviridova
Voronezh State Technical University, Voronezh
Russian Federation
Russian Federation
Senior Lecturer
M. V. Khoroshailova
Voronezh State Technical University, Voronezh
Russian Federation
Russian Federation
Candidate of Sciences (Engineering), Docent
E. V. Syomka
Military Educational and Scientifi c Centre of the Air Force N. E. Zhukovsky and Y. A. Gagarin Air Force Academy the Ministry of Defence of the Russian Federation, Voronezh
Russian Federation
Russian Federation
Candidate of Sciences (Physics and Mathematics), Docent
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Review
For citations:
Turetsky A.V., Pirogov A.A., Sviridova I.V., Khoroshailova M.V., Syomka E.V. Analysis of the infl uence of solder mask roughness and stencil shape on the formation of voids in solder joints. Proceedings in Cybernetics. 2024;23(3):70-81. (In Russ.) https://doi.org/10.35266/1999-7604-2024-3-8
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